Details

Autor(en) / Beteiligte

• Shevelov, M.
• Sieroshtan, V.
• Ruban, O.
• Burygin, A.
• Komakha, P.
• Aleksieiev, O.
• Chayka, O.
• Sevskiy, G.
• Stoehr, P.
• Heide, P.
• Vossiek, M.

Titel

Small form factor and low profile quad-band System-in-Package (SiP) module

Ist Teil von

• 2011 IEEE MTT-S International Microwave Symposium, 2011, p.1-4

Ort / Verlag

IEEE

Erscheinungsjahr

2011

Link zum Volltext

• Volltext

Quelle

IEEE Xplore

Beschreibungen/Notizen

• A very small form factor and low profile quad-band System-in-Package (SiP) module based on the state-of-the-art brand new 65nm CMOS IC is presented. The SiP module provides full function of 2.4G and 5G WLAN, Bluetooth, GPS, FM radio and FM transmitter. The highly integrated device incorporates single chip, RF front-end module, filters for dual band WLAN and GPS, number of SMD components and metal case which provides mechanical protection and implements EMI shielding. A laminate substrate provides the interconnection and distribution of the signals and ground to various components and acts as the carrier to support the die and allow the die IOs to be distributed to the package IOs. Very compact SiP solution with dimensions of 9.5×11.9×1.2mm 3 forms a complete stand-alone multi functional wireless communication system.