Details

Autor(en) / Beteiligte

• Kish, F. A.
• Welch, D.
• Nagarajan, R.
• Pleumeekers, J. L.
• Lal, V.
• Ziari, M.
• Nilsson, A.
• Kato, M.
• Murthy, S.
• Evans, P.
• Corzine, S. W.
• Mitchell, M.
• Samra, P.
• Missey, M.
• DeMars, S.
• Schneider, R. P.
• Reffle, M. S.
• Butrie, T.
• Rahn, J. T.
• Van Leeuwen, M.
• Stewart, J. W.
• Lambert, D. J.
• Muthiah, R. C.
• Tsai, H.
• Bostak, J. S.
• Dentai, A.
• Wu, K.
• Sun, H.
• Pavinski, D. J.
• Zhang, J.
• Tang, J.
• McNicol, J.
• Kuntz, M.
• Dominic, V.
• Taylor, B. D.
• Salvatore, R. A.
• Fisher, M.
• Spannagel, A.
• Strzelecka, E.
• Studenkov, P.
• Raburn, M.
• Williams, W.
• Christini, D.
• Thomson, K. K.
• Agashe, S. S.
• Malendevich, R.
• Goldfarb, G.
• Melle, S.
• Joyner, C.
• Kaufman, M.
• Grubb, S. G.

Titel

Current Status of Large-Scale InP Photonic Integrated Circuits

Ist Teil von

• IEEE journal of selected topics in quantum electronics, 2011-11, Vol.17 (6), p.1470-1489

Ort / Verlag

New York: IEEE

Erscheinungsjahr

2011

Link zum Volltext

• IEEE_Xplore

Quelle

IEEE Electronic Library (IEL)

Beschreibungen/Notizen

• In this paper, the current state of the art for large-scale InP photonic integrated circuits (PICs) is reviewed with a focus on the devices and technologies that are driving the commercial scaling of highly integrated devices. Specifically, the performance, reliability, and manufacturability of commercial 100-Gb/s dense wavelength-division-multiplexed transmitter and receiver PICs are reviewed as well as next- and future-generation devices (500 Gb/s and beyond). The large-scale PIC enables significant reductions in cost, packaging complexity, size, fiber coupling, and power consumption which have enabled benefits at the component and system level.