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3D Numerical Simulation of the Filling and Curing Stages in Epoxy Casting Process
Ist Teil von
2010 International Conference on Electrical and Control Engineering, 2010, p.2584-2587
Ort / Verlag
IEEE
Erscheinungsjahr
2010
Quelle
IEEE/IET Electronic Library (IEL)
Beschreibungen/Notizen
This paper develops a 3-D numerical simulation model for the epoxy casting process including the filling and curing stages. A lot of factors are considered in the model, such as the resin flow, heat transfer, curing reaction, viscosity variation and gravity. The CCD is used to record the flow front advancement during the filling course through a glass window, and some thermocouples are applied to monitor the temperature variation of some key positions during the whole process. The results of experiments verification show close agreements between simulation results and measured data.