Sie befinden Sich nicht im Netzwerk der Universität Paderborn. Der Zugriff auf elektronische Ressourcen ist gegebenenfalls nur via VPN oder Shibboleth (DFN-AAI) möglich. mehr Informationen...
2010 International Conference on Applied Electronics, 2010, p.1-4
2010
Volltextzugriff (PDF)

Details

Autor(en) / Beteiligte
Titel
A proposal for a COM express adapter for energy profiling and long-time failure analysis
Ist Teil von
  • 2010 International Conference on Applied Electronics, 2010, p.1-4
Ort / Verlag
IEEE
Erscheinungsjahr
2010
Quelle
IEL
Beschreibungen/Notizen
  • Since it is possible to use x86 based modules in embedded projects, the complexity of the Embedded World has increased dramatically. This paper describes the results of our current research work, which is aimed at helping the OEM customer of embedded modules, as well as the developers, to track down errors. The paper shows it is possible to monitor the electric power consumption of an embedded module in order to perform instant online energy profiling. The proposed concept consists of an adapter which includes a FPGA and an ARM 7 microcontroller to perform the measurements as well as the data collection. This adapter is put between the x86 "Computer on Module" (which is the Device Under Test (DUT)) and the backplane where it has access to all important buses and signals. The collected data can be accessed remotely via Ethernet and is provided to the DUT using the standardized EC Application Programming Interface (API) or standard bus systems, such as the I2C. The presented work focuses on the widely-used PICMG COM Express Standard but the work can be adapted to other module standards, too.
Sprache
Englisch
Identifikatoren
ISBN: 8070438657, 9788070438657
ISSN: 1803-7232
Titel-ID: cdi_ieee_primary_5599644

Weiterführende Literatur

Empfehlungen zum selben Thema automatisch vorgeschlagen von bX