Details

Autor(en) / Beteiligte

• Chew, C.S.
• Haseeb, A.S.M.A.
• Johan, M.R.

Titel

Wetting behaviour of lead free solder on electroplated Ni and Ni-W alloy barrier film

Ist Teil von

• 2010 3rd International Nanoelectronics Conference (INEC), 2010, p.267-268

Ort / Verlag

IEEE

Erscheinungsjahr

2010

Quelle

IEEE Electronic Library (IEL)

Beschreibungen/Notizen

• In this work, electrodeposited of Ni-W alloys were studied as barrier films between Cu substrate and lead free Sn3.8Ag0.7Cu (SAC387) solder. Wetting angle and spreading rate of SAC387 on Ni-W alloys with different tungsten contents were investigated and compared with that on Ni film deposited from Watt's bath. Ni-W alloy films of about 1.5 to 2.5 ¿m were deposited from ammonia-citrate bath on copper substrate. Results show solder/Ni-W alloy system and solder/Ni system exhibited almost the same spreading rate and wetting angle.