2009 11th Electronics Packaging Technology Conference, 2009, p.486-493
2009
Details
- Autor(en) / Beteiligte
- Titel
- 2N Au wire bonding for ultra fine picth BGA
- Ist Teil von
- 2009 11th Electronics Packaging Technology Conference, 2009, p.486-493
- Ort / Verlag
- IEEE
- Erscheinungsjahr
- 2009
- Link zum Volltext
- Quelle
- IEEE/IET Electronic Library (IEL)
- Beschreibungen/Notizen
- In summary, 2N wire is able to improve thermal aging performance of ultra fine pitch wire bonding to meet reliability requirement as stringent as for automotive application. However, to improve mass production friendliness, careful characterization and process optimization need to be done on several areas, namely bonding surface condition, wire bonding process, as well as wire manufacturing process.
- Sprache
- Englisch
- Identifikatoren
- ISBN: 1424450993, 9781424450992DOI: 10.1109/EPTC.2009.5416499Titel-ID: cdi_ieee_primary_5416499
- Format
- –
- Schlagworte
- 2N Au wire, Aging, BGA packaging, Bonding, dopant, Fingers, Gold, Manufacturing processes, Mass production, Rough surfaces, Substrates, Surface roughness, ultra fine pitch wire bond, Wire