2009 IEEE MTT-S International Microwave Symposium Digest, 2009, p.477-480
2009
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- Autor(en) / Beteiligte
- Titel
- Multi-layer four-way out-of-phase power divider for substrate integrated waveguide applications
- Ist Teil von
- 2009 IEEE MTT-S International Microwave Symposium Digest, 2009, p.477-480
- Ort / Verlag
- IEEE
- Erscheinungsjahr
- 2009
- Quelle
- IEEE Electronic Library Online
- Beschreibungen/Notizen
- In this paper, a novel multi-layer four-way out-of-phase power divider based on substrate integrated waveguide (SIW) is proposed. The four-way power division is realized by 3-D mode coupling; vertical partitioning of a SIW followed by lateral coupling to two half-mode SIW. The measurement results show the excellent insertion loss (S 21 , S 31 , S 41 , S 51 : -7.0 plusmn 0.5 dB) and input return loss (S 11 : -10 dB) in X-band (7.63 GHz ~ 11.12 GHz). We expect that the proposed power divider play an important role for the integration of compact multi-way SIW circuits.
- Sprache
- Englisch
- Identifikatoren
- ISBN: 1424428033, 9781424428038ISSN: 0149-645XeISSN: 2576-7216DOI: 10.1109/MWSYM.2009.5165737Titel-ID: cdi_ieee_primary_5165737
- Format
- –
- Schlagworte
- Costs, Coupling circuits, Insertion loss, Integrated circuit measurements, Laboratories, Loss measurement, Millimeter wave communication, multi-layer substrate, Power divider, Power dividers, Power engineering and energy, Rectangular waveguides, substrate integrated waveguide (SIW)