Details

Autor(en) / Beteiligte

• Coiffic, JC
• Fayolle, M.
• le Poche, H.
• Maitrejean, S.
• Olivier, S.

Titel

Realization of via interconnects based on Carbon Nanotubes

Ist Teil von

• 2008 International Interconnect Technology Conference, 2008, p.153-155

Ort / Verlag

IEEE

Erscheinungsjahr

2008

Quelle

IEEE Xplore

Beschreibungen/Notizen

• This work presents the integration of Carbon Nanotubes (CNT) in via structures for future microelectronic interconnect generations. It is focused on the optimization of the integration schemes to overcome integration issues such as localizing catalyst in the bottom of vias, enabling CNT growth on copper surface, and realizing metal connection on top of CNTs. Two different types of Multiwall-Carbon-Nanotubes (MWCNT), either forest of narrow MWCNTs grown by PECVD have been integrated in these structures. Morphological and electrical characterizations are presented.