Details

Autor(en) / Beteiligte

• Seddon, A.B.
• Furniss, D.
• Pan, W.J.
• Sewell, P.
• Loni, A.
• Zhang, Y.
• Benson, T.M.

Titel

Review: Fine Embossing of Novel Glasses for Photonic Integrated Circuits

Ist Teil von

• 2007 9th International Conference on Transparent Optical Networks, 2007, Vol.2, p.280-283

Ort / Verlag

IEEE

Erscheinungsjahr

2007

Quelle

IEEE

Beschreibungen/Notizen

• Hot embossing of novel inorganic-compound glasses is a new fabrication technology for guided wave devices and circuitry. A patterned mould is pressed into the glass above its glass transition temperature (T g ) and replicated; cooling below T g freezes-in the required pattern. The state-of-the-art is reviewed. Better than 0.1 mum-scale replication is shown for chalcogenide glasses and fabrication of a hot embossed monomode waveguide demonstrated.