Details

Autor(en) / Beteiligte

• Markov, K.
• Keiler, T.
• Chernyakov, A.
• Curtin, C.
• Heide, P.

Titel

Thermal Characterisation of LTCC Frontend Modules with Integrated Power Amplifiers for Wireless LAN Application

Ist Teil von

• 2006 European Microwave Conference, 2006, p.1774-1777

Ort / Verlag

IEEE

Erscheinungsjahr

2006

Quelle

IEEE Electronic Library (IEL)

Beschreibungen/Notizen

• This paper investigates the design and evaluation of low temperature co-fired ceramic (LTCC) heatsinks in frontend modules (FEMs) with integrated power amplifiers (PAs) for wireless-LAN IEEE 802.11 applications. The thermal resistance of this heatsink is measured using two chip thermistors and the accuracy of the proposed measurement method is determined. This method is experimentally validated by the high temperature operating life (HTOL) test, and reliability data is extracted for an EPCOS WLAN FEM with integrated PA, which is currently in mass production