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Simulation Study of Reduced Self-Heating in Novel Thin-SOI Vertical Bipolar Transistors
Ist Teil von
2005 International Conference On Simulation of Semiconductor Processes and Devices, 2005, p.55-58
Ort / Verlag
IEEE
Erscheinungsjahr
2005
Quelle
IEL
Beschreibungen/Notizen
Simulations have been performed to study the self-heating in thin-SOI, vertical bipolar transistors for the first time. Two new device structures are proposed and the simulations show that they can improve the heat dissipation significantly. By adding a heat sink connecting the collector and the substrate and/or having a thin localized BOX underneath the SOI collector, self-heating can be reduced substantially without increasing device area or degrading device performance.