Details

Autor(en) / Beteiligte

• Shinh, G.
• Nakhla, N.
• Achar, R.
• Nakhla, M.
• Dounavis, A.
• Erdin, I.

Titel

Efficient SPICE macromodel for EMI analysis of electronic packages and high-speed interconnects

Ist Teil von

• Electrical Performance of Electronic Packaging - 2004, 2004, p.277-280

Ort / Verlag

IEEE

Erscheinungsjahr

2004

Quelle

IEEE Electronic Library Online

Beschreibungen/Notizen

• This work presents a SPICE macromodel for fast transient analysis of lossy multiconductor transmission line (MTL) interconnects in the presence of electromagnetic interference (EMI). A simplified formulation based on split representation at both ends of the MTL structure for computation of equivalent sources in the time-domain is described. A passive and compact macromodel based on delay extraction and closed-form representation is used to describe the distributed nature of the MTL stamp. The proposed algorithm, while guaranteeing the stability of the simulation by employing passive macromodels, provides significant speed-up for EMI analysis of transmission line networks, especially with large delay and low losses.