Details

Autor(en) / Beteiligte

• Aggarwal, A.O.
• Raj, P.M.
• Abothu, I.R.
• Ravi, D.
• Sacks, M.D.
• Tay, A.A.O.
• Tummala, R.R.

Titel

Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects

Ist Teil von

• 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings, 2004, p.69-73

Ort / Verlag

Piscataway NJ: IEEE

Erscheinungsjahr

2004

Quelle

IEEE Xplore

Beschreibungen/Notizen

• This work explores novel material synthesis routes towards reworkable nano-dimensional interfaces for IC-package assembly, leading to bumpless and nano interconnections. Reworkability is addressed by a thin interface of lead-free high-strength solders. Two approaches, sol-gel process and electroless plating, were used to achieve these nano-dimensional bonding interfaces. In the sol-gel process, metal-organic polymer solutions were heat-treated in a reducing atmosphere at 400/spl deg/C to form lead-free solders (Sn-Ag-Cu). In the electroless plating approach, lead-free alloy films were deposited from aqueous plating solutions consisting of suitable metal salts and reducing agents. This process was done at a temperature of 45/spl deg/C. The lead-free solder composition was controlled by altering the plating bath formulation. Solder films formed from both the above approaches were demonstrated to bond copper pads. Solution-derived nano-solder technology is an attractive low-cost method for bumpless nano-interconnects and other applications such as MEMS hermetic packaging and compliant interconnect bonding.