Details

Autor(en) / Beteiligte

• Heyen, J.
• Kerssenbrock, T.V.
• Chernyakov, A.
• Heide, P.
• Jacob, A.F.

Titel

Novel LTCC-/BGA-modules for highly integrated millimeter-wave transceivers

Ist Teil von

• IEEE MTT-S International Microwave Symposium Digest, 2003, 2003, Vol.2, p.1041-1044 vol.2

Ort / Verlag

IEEE

Erscheinungsjahr

2003

Link zum Volltext

• Volltext

Quelle

IEEE Xplore Digital Library

Beschreibungen/Notizen

• This paper demonstrates advanced packaging concepts for highly integrated encapsulated millimeter-wave modules. Millimeter-wave monolithic integrated circuits (MIMIC) are flip-chip mounted on top of a LTCC package (low temperature co-fired ceramic). This type of "smart package" can integrate all kinds of passive functions as well as compact interconnections between MIMIC and vertical feedthroughs. The bottom side of this package is connected via a standard ball grid array (BGA) to a low-cost laminate PCB serving as motherboard for multiple LTCC modules. Fabricated LTCC test structures and LTCC test packages provide good performance up to about 30 GHz.