Details

Autor(en) / Beteiligte

• Fukushima, Takanori
• Inoue, Masahiro

Titel

Sintering behavior of Silver-Filled Anhydride-Cured Electrically Conductive Adhesives for Enhancing Interfacial Conductivity

Ist Teil von

• 2024 International Conference on Electronics Packaging (ICEP), 2024, p.217-218

Ort / Verlag

Japan Institute of Electronics Packaging

Erscheinungsjahr

2024

Quelle

IEEE Electronic Library Online

Beschreibungen/Notizen

• The effect of the binder chemistry on the low-temperature sintering phenomenon of silver micro-flakes within resin-bonded type electrically conductive adhesives (ECAs) and the interfacial microstructure and interfacial electrical resistivity with metal electrodes were investigated. Silver micro-flakes could be sintered through curing at 150°C for 1 h by appropriately combining binder components and adding reactive diluent. Post-annealed specimens showed progressive sintering of silver micro fillers in the fully hardened resin binder, and these sintering behaviors changed significantly by binder chemical compositions. The interfacial electrical resistivity and the microstructural features with the Cu electrode were also altered depending on the binder chemical composition. These results will be one of the keys to achieving sintered bonding with resin-bonded ECAs.