Details

Autor(en) / Beteiligte

• Lan, Kai-Wei
• Chung, I-Fei
• Tsai, Chun-Pu
• Chen, Ting-Yi
• Li, Wei-Chang

Titel

TCF-Tailoring Vertically Stepped Structures for Temperature Insensitive CMOS-MEMS Resonators

Ist Teil von

• 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS), 2024, p.140-143

Ort / Verlag

IEEE

Erscheinungsjahr

2024

Link zum Volltext

• IEEE_Xplore

Quelle

IEEE Xplore

Beschreibungen/Notizen

• This work demonstrates a temperature compensation scheme using a vertically stepped structure in CMOS-MEMS technology. Particularly, a temperature coefficient of frequency (TCF) tailoring structure composed by stacking metal layers with specifically designed lengths help a metal Al CC-beam resonator yields linear compensation that reduces the first-order TCF 1 from an uncompensated -374.5 ppm/°C to -1.45 ppm/°C with a TCF 2 of -1.09 ppm/°C 2 from -20 °C to 85 °C. Further, polarization voltage tuning across the temperature range, which is based on the resonance frequency read-out of a typical CC-beam resonator as a temperature sensor, achieves parabolic compensation and reduces the overall frequency deviation from 3,309 ppm to 210 ppm from the temperature range of -20 °C to 85 °C.