Details

Autor(en) / Beteiligte

• Chen, Ying Hsuan
• Lwo, Ben-Je
• Liu, Yu-Chen

Titel

A 2 mm Glass-Embedded Fan Out Antenna in Packaging (FOAiP) for 60 GHz mmWave Applications

Ist Teil von

• 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2023, p.50-53

Ort / Verlag

IEEE

Erscheinungsjahr

2023

Quelle

IEEE Xplore

Beschreibungen/Notizen

• To improve radiation performance of a fan-out antenna-in-packaging (FO_AiP), a self-designed, embedded glass with redistribution layers (RDLs) was previously introduced into the FO packaging structure, and the newly aperture-coupled microstrip patch antenna design has been proved to be a suitable design for the 5 th generation (5G) millimeter wave (mmWave) applications. However, the planar dimensions of the early antenna design were relatively large for future devices. In this study, the size of a single glass embedded FO_AiP is minimizing to 2 mm from 3 mm but with compatible electromagnetic (EM) performances. To this end, single factor analysis on the 2 mm FO_AiP was first performed through the ANSYS HFSS software, followed by a consecutive procedure for structure improvements. As a result, a 2 mm FO_AiP model with 5.5 dB gain and 3.96 GHz bandwidth is proposed for 5G applications at 60 GHz.