Details

Autor(en) / Beteiligte

• Fukushima, Takanori
• Inoue, Masahiro

Titel

Interconnection Properties of Epoxy-based Conductive Adhesives by Chemically Controlled Sintering of Silver Micro-fillers

Ist Teil von

• 2023 International Conference on Electronics Packaging (ICEP), 2023, p.237-238

Ort / Verlag

Japan Institute of Electronics Packaging

Erscheinungsjahr

2023

Quelle

IEEE Electronic Library Online

Beschreibungen/Notizen

• The effect of the binder chemical composition on interfacial microstructure and the electrical connection property of the adhesion interface between silver (Ag) micro-flakes filled electrically conductive adhesives (ECAs) and metal electrodes were investigated. The effect of binder chemical composition was also shown on the change in electrical conductive property through post-annealing. Furthermore, the interfacial electrical resistivity after curing and post-annealing and the interfacial microstructure after post-annealing were changed depending on the binder chemical composition. Post-annealed specimens showed progressive sintering of silver micro fillers in the cured resin binder and inter-diffusion of silver and copper at the adhesive interface. These results will be one of the essential keys to the material design of ECAs having favorable interfacial properties.