Details

Autor(en) / Beteiligte

• LEE, Jong-Soo
• LEE, Young-Min
• NAM, Choong-Mo
• JEONG, In-Ho
• KIM, Dong-Wook
• KWON, Young-Se

Titel

System in a package solution for RF receiver with SAW filter integration

Ist Teil von

• 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2002, p.1012-1017

Ort / Verlag

Piscataway NJ: IEEE

Erscheinungsjahr

2002

Quelle

IEEE Xplore

Beschreibungen/Notizen

• An RF receiver module including a SAW filter in a package has been developed for providing a system in a package (SIP) solution. The most significant feature for the receiver module is that the RF SAW (surface acoustic wave) filter is integrated within the package. A typical silicon substate with thick oxide on top (/spl sim/25 /spl mu/m) made it possible to implement the different technologies such as GaAs MMIC and SAW filter on a single substate. MCM-D technology using a silicon substrate in this paper shows the proper solution for a SIP. RF performance and basic circuit components such as inductors, capacitors, resistors and transmission lines are developed. To verify the application of a silicon substrate to a system, an RF receiver module having dual band/tri-mode functions (CDMA, AMPS, and PCS) is implemented on a silicon substrate. A low noise amplifier, RF SAW filter and mixer are integrated on a specialized silicon substrate and show 2.4/spl sim/3 dB NF and 27/spl sim/28 dB gain for PCS (1840/spl sim/1870 MHz) and CDMA (869/spl sim/894 MHz), respectively.