Sie befinden Sich nicht im Netzwerk der Universität Paderborn. Der Zugriff auf elektronische Ressourcen ist gegebenenfalls nur via VPN oder Shibboleth (DFN-AAI) möglich. mehr Informationen...
Ergebnis 11 von 184
Construction & building materials, 2019-12, Vol.227 (227), p.116627, Article 116627
2019

Details

Autor(en) / Beteiligte
Titel
Development of a sensor for monitoring mechanically stressed adhesive joints
Ist Teil von
  • Construction & building materials, 2019-12, Vol.227 (227), p.116627, Article 116627
Ort / Verlag
Elsevier Ltd
Erscheinungsjahr
2019
Link zum Volltext
Quelle
Alma/SFX Local Collection
Beschreibungen/Notizen
  • [Display omitted] •Delamination sensor reliably detects debonding of retrofitted CFRP from steel.•The sensor materials are selected to optimally peel within the capacitive plane.•A model was developed to describe the three phases of sensor delamination.•Allows qualitative monitoring of the effectiveness of rehabilitation measures with CFRP. A strengthening system with adhesively bonded CFRP reinforcement was developed in the Infravation project FASSTbridge to extend the remaining fatigue lifetime of existing steel bridge constructions. The premature debonding of CFRP and steel is seen as a major risk to lose the contribution of the retrofitting system. Consequently, an ultrathin debonding sensor to be integrated in the adhesive layer between steel and CFRP was developed as part of the strengthening system. It is suited for continuous monitoring of the integrity of the adhesive joint. The paper explains the underlying physical principles of the sensor and gives insight into the performed tests for the calibration and verification of its functionality. The sensor conception takes the change of a capacitor’s electrical impedance as a basis, which occurs when a change in distance between the adjacent conductive faces takes place. It is well assumed that debonding yields separation, which leads to an increase of the monitored impedance. The relationship is explored through single lap sheer experiments and vertical tension bond tests. The sensitivity and the accuracy of the impedance with respect to deformations are revealed by comparing several groups of prototypes with different dielectric layers and viscous materials. The influences of different temperature effects and fatigue loadings are also presented.
Sprache
Englisch; Französisch
Identifikatoren
ISSN: 0950-0618
eISSN: 1879-0526
DOI: 10.1016/j.conbuildmat.2019.08.008
Titel-ID: cdi_hal_primary_oai_HAL_hal_02289799v1

Weiterführende Literatur

Empfehlungen zum selben Thema automatisch vorgeschlagen von bX