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Failure mechanisms of discrete protection device subjected to repetitive electrostatic discharges (ESD)
Ist Teil von
Microelectronics and reliability, 2009-09, Vol.49 (9), p.1103-1106
Ort / Verlag
Kidlington: Elsevier Ltd
Erscheinungsjahr
2009
Quelle
Alma/SFX Local Collection
Beschreibungen/Notizen
High reliability electronic devices need to sustain thousands of electrostatic discharge (ESD) stresses during their lifetime. In this paper, it is demonstrated that repetitive ESD stresses on a protection device such as a bidirectional diode induce progressive defects into the silicon bulk. With “Sirtl etch” failure analysis technique, the defects could be localized quite precisely at the peripheral in/out junctions. The degradation mechanisms during repetitive IEC 61000-4-2 pulses have been investigated on a protection diode with the objective of improving the design for sustaining 1000 pulses at 10
kV level.