IEEE journal of the Electron Devices Society, 2023-01, Vol.11, p.1-1
2023
Details
- Autor(en) / Beteiligte
- Titel
- High Temperature and Width Influence on the GIDL of Nanowire and Nanosheet SOI nMOSFETs
- Ist Teil von
- IEEE journal of the Electron Devices Society, 2023-01, Vol.11, p.1-1
- Ort / Verlag
- New York: IEEE
- Erscheinungsjahr
- 2023
- Link zum Volltext
- Quelle
- EZB Free E-Journals
- Beschreibungen/Notizen
- In this work, an experimental evaluation of Gate-Induce Drain Leakage (GIDL) current is presented for nanowire and nanosheet-based SOI transistors. The effects of fin width and temperature increase are studied. Obtained results indicate that the increase in device width makes the GIDL current more sensitive to temperature increase. Three-dimensional numerical simulations have shown that despite the reverse junction leakage increase with temperature, leakage current in nanosheet and nanowire transistors is composed predominantly of GIDL current. The change in valence and conduction bands caused by temperature increase favors the band-to-band tunneling, which is responsible for the worsening of GIDL at high temperatures.
- Sprache
- Englisch
- Identifikatoren
- ISSN: 2168-6734eISSN: 2168-6734DOI: 10.1109/JEDS.2023.3264876Titel-ID: cdi_doaj_primary_oai_doaj_org_article_9e6042c79c994b99bffde9869fb1e810
- Format
- –
- Schlagworte
- Conduction bands, Conduction heating, Current measurement, GIDL, High temperature, Leakage current, Logic gates, Nanoscale devices, nanosheet MOSFET, Nanosheets, nanowire MOSFET, Nanowires, SOI, SOI (semiconductors), Temperature effects, Temperature measurement, Threshold voltage, Transistors, Voltage measurement