Details

Autor(en) / Beteiligte

• Zhang, Yutong
• Zhou, Weihua
• Tang, Jinyuan
• He, Yuhui

Titel

Understanding Effects of Ultrasonic Vibration on Microstructure Evolution in Hot Forming Process via Cellular Automata Method

Ist Teil von

• Materials, 2022-10, Vol.15 (20), p.7359

Ort / Verlag

Basel: MDPI AG

Erscheinungsjahr

2022

Link zum Volltext

Quelle

EZB Electronic Journals Library

Beschreibungen/Notizen

• Compared with traditional forming technology, ultrasonic vibration-assisted plastic forming technology can improve the forming conditions and obtain better surface quality of the workpiece. However, the mechanism and theory of ultrasonic action have not formed a unified understanding. In this paper, ultrasonic-assisted thermal forming technology is taken as the research object. Through experimental research combined with cellular automata methods, based on the dislocation density model, nucleation and growth model, and dynamic recrystallization growth rule, a theoretical model for microstructure simulation of the ultrasonic-assisted thermal forming process was established. By introducing the ultrasonic energy field into the thermal forming process and correcting thermal activation energy and dynamic recovery coefficient, the reasons for flow stress reduction of 9310 steel and the influence of temperature, strain rate, and vibration amplitude on recrystallization were analyzed from the microscopic scale. The results show that the introduction of ultrasonic vibration reduces the dislocation activation energy, promotes dynamic recrystallization behavior, and finally leads to the reduction of flow stress. With an increase in vibration amplitude, the average grain size decreases faster, the recrystallization volume fraction increases faster, the stress decreases larger, and the ultrasonic softening phenomenon becomes more obvious. Decreasing the strain rate will promote the occurrence of dynamic recrystallization, the volume fraction and average grain size of dynamic recrystallization will increase, and the true stress will decrease.