Details

Autor(en) / Beteiligte

• Deng, Qian Fa
• Wang, Yang Yu
• Yuan, Ju Long
• Lv, Xun

Titel

Study on Parameters Optimization in Ultra-Precise Processing of Germanium Substrate

Ist Teil von

• Advanced materials research, 2009, Vol.69-70, p.442-445

Ort / Verlag

Trans Tech Publications Ltd

Erscheinungsjahr

2009

Quelle

Alma/SFX Local Collection

Beschreibungen/Notizen

• To improve efficiency in ultra-precision lapping germanium (Ge) substrate, a new ultra-precise process technology is introduced in this paper. Two steps ultra-precise process were semi bonded abrasive lapping in rough machining, and CMP process in finish machining. A good surface quality workpiece was obtained in semi bonded abrasive lapping process efficiently. Several machining parameters were compared and applied. After CMP process, the mirror-like surface of Ge substrate was obtained.