Details

Autor(en) / Beteiligte

• Poodt, Paul
• Cameron, David C.
• Dickey, Eric
• George, Steven M.
• Kuznetsov, Vladimir
• Parsons, Gregory N.
• Roozeboom, Fred
• Sundaram, Ganesh
• Vermeer, Ad

Titel

Spatial atomic layer deposition: A route towards further industrialization of atomic layer deposition

Ist Teil von

• Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2012-01, Vol.30 (1), p.010802-010802-11

Ort / Verlag

American Vacuum Society

Erscheinungsjahr

2012

Link zum Volltext

Quelle

American Institute of Physics

Beschreibungen/Notizen

• Atomic layer deposition (ALD) is a technique capable of producing ultrathin conformal films with atomic level control over thickness. A major drawback of ALD is its low deposition rate, making ALD less attractive for applications that require high throughput processing. An approach to overcome this drawback is spatial ALD, i.e., an ALD mode where the half-reactions are separated spatially instead of through the use of purge steps. This allows for high deposition rate and high throughput ALD without compromising the typical ALD assets. This paper gives a perspective of past and current developments in spatial ALD. The technology is discussed and the main players are identified. Furthermore, this overview highlights current as well as new applications for spatial ALD, with a focus on photovoltaics and flexible electronics.