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We present measurements of the lower yield point of undoped floating-zone silicon at temperatures between 800 and 1300 °C. The knowledge of the defect structure in this temperature range is of considerable importance for the numerical simulation of dislocation generation in various solar silicon materials. Above about 1050 °C, we find marked deviations from the well-known low-temperature behavior, thus establishing a further deformation regime. It is characterized by an activation energy of 4.1 eV. Comparison to preliminary work indicates that this effect depends on the as-grown dislocation density, but not on the ambient during deformation. We tentatively assume that it may reflect the change in the mechanism of self-diffusion typical for silicon at high temperatures.
Sprache
Englisch
Identifikatoren
ISSN: 0003-6951
eISSN: 1077-3118
DOI: 10.1063/1.124652
Titel-ID: cdi_crossref_primary_10_1063_1_124652
Format
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