Details

Autor(en) / Beteiligte

• Thieme, C. L. H.
• Rodrigues, D.
• Foner, S.

Titel

Grain size reduction in Nb3Sn wire using composite powder metallurgy filaments with Cu(Sn) artificial pinning centers

Ist Teil von

• Applied physics letters, 1994-08, Vol.65 (8), p.1042-1044

Erscheinungsjahr

1994

Link zum Volltext

Quelle

AIP Scitation Journals Complete

Beschreibungen/Notizen

• Cu(Sn) artificial pinning centers (APCs) were introduced into multifilamentary Nb3Sn wire using powder metallurgy Nb+Cu rods. In the composite Nb+Cu filaments the Cu ribbons had a thickness of either 20 or 5 nm before reaction. During the 600 °C anneal the APCs enhanced the reaction rate and reduced the Nb3Sn grain size to <20 nm. The Cu concentration in the filaments decreased. In 20% Cu-20 nm APC wires the critical current density over the A15 area was 2250 A/mm2 at 12 T and 4.2 K. Flux pinning increased strongly with decreasing field.