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The effect of silver particle size and organic stabilizers on the conductivity of silver particulate films in thermal sintering processes
Ist Teil von
Thin solid films, 2016-10, Vol.616, p.366-374
Ort / Verlag
Elsevier B.V
Erscheinungsjahr
2016
Link zum Volltext
Quelle
Alma/SFX Local Collection
Beschreibungen/Notizen
Herein, we investigated the effect of silver particle size and the type of organic stabilizers on the conductivity and morphology of silver particulate films upon sintering at different temperatures. Four types of silver nanoparticles were prepared via chemical reduction in the presence of three different types of organic stabilizers. These silver nanoparticles, which were different in size, were then fabricated into silver ink pastes, printed to form silver films, and sintered. It was found that the size of the silver nanoparticles was the main factor that influenced the initial decrease in the resistivity of the films; this was accomplished by neck formation between particles. Alternatively, the type of organic stabilizer was the most important factor for determining the final resistivity in the conductive films; this was accomplished by the interconnections of silver nanoparticles via extended neck formation. The amount of organic stabilizers also affected the sintering temperature that was required for the films to be conductive and influenced the final resistivity of the conductive films. The lowest resistivity (2.2μΩcm) was obtained for the film that was prepared using 3.4nm silver nanoparticles, hexyl amine as a stabilizer, and sintered at 220°C.
•Silver nanoparticles with various sizes were prepared using organic stabilizers.•Conductive silver films were prepared by silkscreen printing and thermal sintering.•The size of particles was the main factor for initial decrease of the resistivity.•The type of stabilizer was the important factor for the final resistivity of film.•The amount of stabilizer affected the sintering temperature and final resistivity.