Details

Autor(en) / Beteiligte

• Wang, Rui
• Xie, Congzhen
• Gou, Bin
• Xu, Huasong
• Luo, Shoukang
• Zhou, Jiangang
• Zeng, Leilei

Titel

Epoxy nanocomposites with high thermal conductivity and low loss factor: Realize 3D thermal conductivity network at low content through core-shell structure and micro-nano technology

Ist Teil von

• Polymer testing, 2020-09, Vol.89, p.106574, Article 106574

Ort / Verlag

Elsevier Ltd

Erscheinungsjahr

2020

Quelle

Free E-Journal (出版社公開部分のみ）

Beschreibungen/Notizen

• Dielectric polymers with high thermal conductivity are very promising in the fields of aerospace and electronic device packaging. However, composites with excellent dielectric properties usually have low thermal conductivity. It is usually to fill the polymer with thermal conductivity particles to improve the thermal conductivity, but the high content of filler often reduces the mechanical properties of the polymer. In this paper, the traditional insulating polymer epoxy resin was used as the matrix, by covering the surface of silicon carbide with graphene to form a core-shell structure and co-filled with nano diamonds to achieve the preparation of high-performance epoxy resin at low content. The results showed that at the filling content of 30 wt%, the thermal conductivity of epoxy nanocomposites showed a dramatic thermal conductivity enhancement of 1263%, the energy storage modulus increased by 1.1 GPa, and the dielectric loss remained unchanged at 50 Hz. The advantages of the composite are the structural design and surface modification of the filler, which not only take advantage of its inherent advantages, but also improve the interface area with the epoxy matrix. The composite materials with excellent properties are expected to provide theoretical guidance for the application of high thermal conductivity dielectric materials. •The core-shell structure was prepared for enhancing the thermal conductivity of epoxy nanocomposites.•Nano-diamond was used to suppress the increase of dielectric constant and dielectric loss.•The graphene shell layer can greatly improve the heat transfer efficiency.•Micro-nano structure was formed to improve the storage modulus.•SiC can prevent the formation of electrical conductive paths of graphene.