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Autor(en) / Beteiligte
Titel
Misorientation angle distribution of deformation-induced boundaries provided by their EBSD-based separation from original grain boundaries: Case study of copper deformed by compression
Ist Teil von
  • Materials characterization, 2019-01, Vol.147, p.184-192
Ort / Verlag
Elsevier Inc
Erscheinungsjahr
2019
Link zum Volltext
Quelle
Access via ScienceDirect (Elsevier)
Beschreibungen/Notizen
  • Grain lattice fragmentation in heavily deformed metals is controlled by the formation of deformation-induced boundaries (DIBs) with misorientations evolving from low to high angles with increasing strain. A method is suggested allowing the separation of the contributions from DIBs and original grain boundaries to the overall misorientation angle distribution based on electron backscatter diffraction (EBSD) data. The peculiarities, accuracy and limitations of the method are considered by the example of copper under uniaxial compression at room temperature and 150 °C. It is shown that obtained distributions of DIB misorientation can be analyzed using their representation as a superposition of partial distributions. The partial distributions f1 and f2, which describe the low-angle interval, correlate with the distributions determined earlier by the transmission electron microscopy for two types of dislocation boundaries, while the third partial distribution f3 relates to the high-angle DIBs, whose misorientations go beyond the range of the first two distributions. The rise of deformation temperature does not affect the character of misorientation distribution development. •A method to study the misorientation distribution of deformation-induced boundaries.•Representation of such a distribution as a sum of three partial distributions.•First two partial distributions correlate with previously obtained results of TEM.•Third partial distribution describes the high-angle portion of total distribution.
Sprache
Englisch
Identifikatoren
ISSN: 1044-5803
eISSN: 1873-4189
DOI: 10.1016/j.matchar.2018.11.003
Titel-ID: cdi_crossref_primary_10_1016_j_matchar_2018_11_003

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