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The effects of cooling rate and heat treatment on mechanical and thermal characteristics of Al–Si–Cu–Mg foundry alloys
Ist Teil von
Journal of alloys and compounds, 2014-12, Vol.617, p.654-659
Ort / Verlag
Kidlington: Elsevier B.V
Erscheinungsjahr
2014
Link zum Volltext
Quelle
Elsevier ScienceDirect Journals
Beschreibungen/Notizen
•The microstructure of eutectic silicon depended on the mold temperature.•Heat treatment has caused the eutectic silicon phase to be spheroidized.•After heat treatment, the long needles of eutectic silicon particles were broken down into smaller fragments.•The high spheroidizing degree of the eutectic silicon by heat treatment affected the increase in thermal diffusivity.•This phenomenon can find the application in automotive engine components.
The microstructure of the Al–9.7Si–0.7Cu–0.4Mg alloy solidified by different cooling rates was reported in this study and solution heat treatment followed by aging treatment was carried out for the effects of heat treatment on mechanical and thermal characteristics. The solution treatment was performed at 535°C for 6h and then the specimens were cooled by water quenching. The samples were aged at 180°C or 190°C for 1–10h. By heat treatment, the long needles of eutectic silicon particles were broken down into smaller fragments and then gradually spheroidized. Spheroidizing of the eutectic silicon particles has found to improve the tensile strength and thermal diffusivity of the alloy. In particular, as increasing the aging temperature of Al–Si–Cu–Mg alloy from 180°C to 190°C, the 3% higher thermal conductivity was achieved.