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Details

Autor(en) / Beteiligte
Titel
Effective removal of metal-carbide contamination from diamond circuit boards by reactive ion etching
Ist Teil von
  • Diamond and related materials, 2023-11, Vol.139, p.110329, Article 110329
Ort / Verlag
Elsevier B.V
Erscheinungsjahr
2023
Quelle
Alma/SFX Local Collection
Beschreibungen/Notizen
  • Recently, we have demonstrated the feasibility of using laser-patterned polycrystalline diamond sheets as a substrate for implantable circuit boards. The laser grooves in the diamond can be filled with biocompatible braze alloys such as Au-ABA and polished back to create long-lasting, hermetic circuit boards suitable for implantation in the human body. However, during the process of depositing molybdenum and niobium layers to aid adhesion of the Au-ABA braze, a residual film was found to form, which was resistant to both polishing and chemical etching, resulting in electrical shorting between features on the circuit board. Here, we report an optimised reactive ion etching process to remove the residual metal contamination and electrically isolate fine features on the diamond circuit boards. Samples were evaluated through energy dispersive spectroscopy elemental analysis and electrical testing of the diamond surface, confirming the complete removal of contaminants from the diamond surface. [Display omitted]
Sprache
Englisch
Identifikatoren
ISSN: 0925-9635
eISSN: 1879-0062
DOI: 10.1016/j.diamond.2023.110329
Titel-ID: cdi_crossref_primary_10_1016_j_diamond_2023_110329
Format
Schlagworte
Braze, Circuit board, Device, Medical, RIE

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