Details

Autor(en) / Beteiligte

• Qiu, Juan
• Gao, Xiang
• Li, Guiqiu
• Feng, Kanglu
• Gongsun, Kangwei
• Chen, Chunchao
• Bu, Changming
• Ma, Houyi

Titel

Synergistic effect of molybdate or tungstate and water soluble thiol on the corrosion protection of copper

Ist Teil von

• Applied surface science, 2024-05, Vol.654, p.159418, Article 159418

Ort / Verlag

Elsevier B.V

Erscheinungsjahr

2024

Quelle

Access via ScienceDirect (Elsevier)

Beschreibungen/Notizen

• [Display omitted] •Dithiol-assisted molybdate or tungstate based film were fabricated on copper.•The fabricated films exhibited double-layer structure.•The top layer was organic layer and underlayer consisted of Cu2S.•The oxidation of dithiol by molybdate or tungstate resulted in a thicker film.•The films exhibited high corrosion protection efficiency. An approach to fabricate protective film on copper substrate utilizing molybdate or tungstate assisted by dithiol was proposed. The fabricated films exhibited double-layer structure. The top layer was an organic layer primarily composed of interconnected dithiol molecules through disulfide bonds originating from the oxidation of molybdate or tungstate. The Cu2S bottom-layer formed as a result of the cleavage of C-S bonds subsequent to the adsorption of dithiol molecules onto the copper matrix. The molybdate participated the film via MoOx and MoSx. Although no tungstate species were detected in the film, the oxidizing effect of tungstate facilitated a conversion of dithiol molecules into polymers, resulting in a significantly thicker surface layer. The corrosion protection efficiencies of the films reached 99.7 % and 99.8 %, respectively, attributed to the incorporation of molybdate or tungstate additives. Theoretical calculations provided valuable insights into the process of film formation and elucidated the relationship between film structure and anti-corrosion performance.