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Kinetics of voids evolution during diffusion bonding of dissimilar metals on consideration of the realistic surface morphology: Modeling and experiments
A comprehensive model for analyzing the kinetics of void evolution and shrinkage during dissimilar diffusion bonding is proposed based on the sinusoidal profile. The model incorporates atom accumulation at void tip to determine the curvature radius of void neck, and integrates the local effect of surface diffusion to quantify the contribution of surface diffusion, thus avoiding the unrealistic void evolution observed in previous models. Furthermore, the model utilizes a combined diffusion coefficient for multicomponent alloys under the effect of stress and concentration gradients, to determine the interfacial diffusion coefficient for dissimilar joints. In contrast to previous models, the current model demonstrates significant improvements in predicted accuracy, efficiently depicting the realistic void evolution and interpreting the formation of various interfacial voids, which can be applied in various bonding cases, including for the dissimilar base metals with different surface conditions. Simulation results from bonding between austenitic steel and ferritic steel with different surface roughness reveal that interfacial voids predominantly form on the side of the base metal with the rougher bonding surface. Additionally, as surface roughness decreases, the prevailing surface source diffusion and interface source diffusion mechanisms promote void evolution and shrinkage, resulting in a significant reduction of the final bonding time. To achieve a high-quality bonding joint, it's suggested to place the smoother bonding surface on the higher creep-resistant base metal, which can accelerate the void closure process.
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