Details

Autor(en) / Beteiligte

• Shinozaki, D.M.
• Klauzner, A.
• Cheng, P.C.

Titel

Inelastic deformation of polyimide-copper thin films

Ist Teil von

• Materials science & engineering. A, Structural materials : properties, microstructure and processing, 1991-08, Vol.142 (1), p.135-144

Ort / Verlag

Amsterdam: Elsevier B.V

Erscheinungsjahr

1991

Quelle

Elsevier ScienceDirect Journals Complete

Beschreibungen/Notizen

• Thin-layered composites of polyimide-copper are tested in tension. The specimens are prepared using standard thin film preparation techniques. The stress relaxation behaviour of the two phases is measured and modelled in terms of a single activated rate process. The internal stress in the polyimide is measured and increases with tensile strain. The deformed samples are examined with laser-scanning confocal microscopy and standard optical microscopy. Microcracks in copper and shear bands in polyimide are observed and correlated qualitatively with the stress relaxation model.