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Creep Behaviour of SAC387 Lead Free Solder Alloy Reinforced with Single Walled Carbon Nanotubes
Ist Teil von
Transactions of the Indian Institute of Metals, 2015-04, Vol.68 (2), p.311-317
Ort / Verlag
India: Springer India
Erscheinungsjahr
2015
Quelle
Alma/SFX Local Collection
Beschreibungen/Notizen
The effect of addition of single walled carbon nanotubes (SWCNTs) on creep behaviour of Sn–3.8Ag–0.7Cu (SAC387) lead free solder alloy was investigated. The creep tests were carried out using indentation technique by means of a nanoindenter. Modified Garofalo’s creep model showed an excellent fit to the indentation depth versus time data and was used to extract the creep parameters. The results showed that the steady state creep rate as well as primary creep stage displacement and primary creep stage time decreased with increasing addition of SWCNT to the base alloy.