Details

Autor(en) / Beteiligte

• LEE, S. W. Ricky
• ZHANG, Rong
• CHEN, K.
• LO, Jeffery C. C.

Titel

Emerging trend for LED wafer level packaging

Ist Teil von

• Frontiers of Optoelectronics (Online), 2012-06, Vol.5 (2), p.119-126

Ort / Verlag

Heidelberg: Higher Education Press

Erscheinungsjahr

2012

Quelle

Alma/SFX Local Collection

Beschreibungen/Notizen

• Currently most light emitting diode (LED) components are made with individual chip packaging technology. The main manufacturing processes follow conventional chip-based IC packaging. In the past several years, there has been an uprising trend in the IC industry to migrate from chip-based packaging to wafer level packaging (WLP). Therefore, there is a need for LEDs to catch up. This paper introduces advanced LED WLP technologies. The contents cover key enabling processes such as preparation of silicon sub-mount wafer, implementation of interconnection, deposition of phosphor, wafer level encapsulation, and their integration. The emphasis is placed on how to achieve high throughput, low cost manufacturing through WLP.