Microsystem technologies : sensors, actuators, systems integration, 2012-03, Vol.18 (3), p.257-265
2012
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Details
- Autor(en) / Beteiligte
- Titel
- Hot embossing at viscous state to enhance filling process for complex polymer structures
- Ist Teil von
- Microsystem technologies : sensors, actuators, systems integration, 2012-03, Vol.18 (3), p.257-265
- Ort / Verlag
- Berlin/Heidelberg: Springer-Verlag
- Erscheinungsjahr
- 2012
- Quelle
- SpringerLink
- Beschreibungen/Notizen
- In this paper, a new hot embossing process, molding at the viscous state, for fabrication of complex polymer structures at the micro and millimeter scale is presented. Polymer deformability is enhanced due to its low viscosity and is increased by an inner pressure from confinement of the polymer flow. Various millimeter-scale polymer structures with high aspect ratios and complex features were hot embossed. In addition, typical microstructures were achieved. This new approach promises the advantages of a broad process capability and strong compatibility with conventional hot embossing processes.
- Sprache
- Englisch
- Identifikatoren
- ISSN: 0946-7076eISSN: 1432-1858DOI: 10.1007/s00542-011-1389-5Titel-ID: cdi_crossref_primary_10_1007_s00542_011_1389_5
- Format
- –
- Schlagworte
- Applied sciences, Electronics, Electronics and Microelectronics, Engineering, Exact sciences and technology, Instrumentation, Instruments, apparatus, components and techniques common to several branches of physics and astronomy, Machinery and processing, Mechanical Engineering, Mechanical engineering. Machine design, Mechanical instruments, equipment and techniques, Microelectronic fabrication (materials and surfaces technology), Micromechanical devices and systems, Moulding, Nanotechnology, Physics, Plastics, Polymer industry, paints, wood, Precision engineering, watch making, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Technical Paper, Technology of polymers